BHA Resin, 200-400 mesh, 0.3-0.8 mmol/g

Catalog Number	ACMA00046447
Description	BHA resin has been used as solid carrier for preparation of peptide amides by Boc SPPS. Amino acids can be attached to the support using standard amide bond-formation methods. The cleavage of the carboxylic amides from the resin requires strong acids such as trifluoromethane sulfonic acid or HF. These resins are also used as core ones for they are stable to a wide range of acidic and basic conditions.
Cross Link	0.01 (DVB)
Functional Group	NH2 Functionalized Resins
Loading	0.3-0.8 mmol/g
Packaging	5g/25g/100g
Particle Size	200-400 mesh